Features and Benefits

True consumer AR – glasses that are stylish, cosmetically practical, lightweight, and produce a stunningly beautiful image overlaid on the “real life” background a user is viewing - presents a conundrum. There are four conflicting performance objectives all of which must be made cost-effectively. Micledi is the only company optimally responding to the challenges of all four corners and low-cost, high-volume production.

Magic 5 Parameter

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MICLEDI is committed to designing and developing the industry’s best microLED display modules

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Resolution

RESOLUTION = FHD, 4K, 8K
<3um sub-pixel pitch.
>9K PPI today
>14K Phase 2
Pixel shrink to 2u pitch
Micro-lens - pixel by pixel
+/- 20degree Apex angle

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Power Consumption

< 1W @ usage scenario

< 0.5W @ FHD

< 0.2W @ 1⁄2 FHD, HD

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Low cost

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Brightness

Up to 10Mnits
> 1Mnit @ D65 white point
1Mnits with quantum dots
Brightness - app dependent

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Image Quality

De Mura / Gamma

Lifetime degradation

Backplane controlled

Great contrast / optical isolation

Benefits

Makers of advanced AR headgear reap the benefits of all of the above features enabling them to make the most feature rich AR headsets. Ultimately, the greatest benefit, after these technical features listed above is that Micledi’s unique approach to building these microLED display modules is that they are more cost-effective vs. performance than any other microLEDs in the market today.

Manufacturing Value Proposition

Today, microLED display modules are made using a variety of wafer sizes for LED manufacturing after which the microLED wafer is bonded to an ASIC backplane (CMOS) wafer.  The CMOS wafer is then cut down (cored out) to match the size of the epi wafer, wasting more than half of the CMOS wafer.  COSTLY!!!

MICLEDI HIGH VOLUME MANUFACTURING FLOW

Diagram of the process for creating a CMOS LED wafer from silicon and LED wafer materials, including steps such as LED processing, hybrid bonding, and front side processes.

Using MICLEDI’s unique wafer reconstitution procedure, EPI starting material is diced and selectively placed on a 300mm silicon carrier wafer – no bow, no stress, known good epi die.  The entire LED processing takes place in a world-class 300mm production wafer flow for low-cost mass production.  Industry standard or customized CMOS backplane wafers are hybrid bonded to MICLEDI’s LED wafer, then diced, packaged, tested, yielding fully integrated microLED display modules without ever having to discard portions of the CMOS ASIC backplane wafer.

FULLY INTEGRATED MICROLED DISPLAYS

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Beautifully planarized, MICLEDI’s 300mm reconstituted “epi wafer on standard silicon” boasts nearly 100% die attach yield.  Using all high-precision photolithography equipment readily available in world class 300mm CMOS foundries, MICLEDI’s microLEDs capitalize on many of the manufacturing practices that have been in common use making backside illuminated imagers in high volume.  Proven methods translate into no wafer breakage due to stress during LED processing, predictable performance, and high yields.

Applications & Solutions

Monochrome Displays

Monochrome displays, blue or green, with or without microlenses, are available today. Superior monochrome microLED display modules can be made using MICLEDI’s innovative approach. The device architecture is tuned for each color to get the maximum light extraction efficiency with optimized beamshape. MICLEDI’s three-panel approach produces outstanding monochrome panels and enables best full-color RGB when integrated together.

Three-Panel RGB die-by-die

  • Best AR display solution

  • Lowest display cost

  • High system assembly cost

  • Large FOV/Outdoor AR

  • 3-layer waveguide

  • 3 separate collimation lens assembly

Medium Performance Full Color RGB

With the fundamental performance of MICLEDI’s monochrome arrays it is only natural that customers looking for full color but with lower resolution and lower brightness turn to MICLEDI. Quantum Dots are an effective way to achieve full color for medium performance applications with Narrower FOV, indoor lighting, for viewfinders and HUD displays among other applications.

RGB pixel-by-pixel

(Down-conversion)

  • Low perf. AR display solution

  • Medium display cost

  • Low system assembly cost

  • Narrow FOV/indoor AR

  • Viewfinder/head-up display

Full Color RGB – Display of the Future

With each color wafer producing microLED arrays of outstanding performance characteristics – red, green, and blue, MICLEDI has shown at recent technical conferences, the idea of full-color RGB by stacking individual color wafers using proven hybrid bonding to stack red, green, and blue into the smallest full-color RBG footprint. The future brings this exciting development.

RGB pixel-by-pixel “stacked”

  • Medium perf. display solution

  • Highest display cost

  • Low system assembly cost

  • Medium FOV/Outdoor AR

  • Single- or 2/3-layer waveguide

  • Single collimation lens assembly